Using PET and PI as substrates, combined with high-performance acrylic adhesive<br /><br />Excellent adhesion to various materials<br />Good electrical insulation, high and low temperature resistance, weather resistance<br />Low glue overflow, easy for die-cutting<br /><br />Applicable to the bonding and covering of electronic components in electronic products
Using PET and PI as substrates, combined with high-performance acrylic adhesive<br /> <br />Excellent adhesion to various materials<br />Good electrical insulation, high and low temperature resistance, weather resistance<br />Low glue overflow, easy for die-cutting<br /> <br />Suitable for bonding and fixing the surface of electronic components in electronic products.
Using PET as the substrate, combined with acrylic adhesive<br /> <br />Good adhesion effect on various smooth and rough surfaces<br />Low adhesion, easy to stick, small change in adhesion force of the product over time after sticking<br />Excellent re-peelability and no pollution<br /> <br />Suitable for protective purposes in production processes such as mobile phone panels, glass lenses, touch screen modules, etc
Using PET as the substrate combined with polyurethane adhesive<br /><br />Excellent adsorption performance for various smooth materials<br />Low adhesion, easy to stick, and the adhesive force of the product changes little over time after sticking<br />Excellent re stripping ability and no pollution<br /><br />Suitable for protective purposes in production processes such as mobile phone panels, glass lenses, touch screen modules, etc
Using PE foam as the substrate, combined with high-performance acrylic adhesive<br /><br />Excellent bonding performance for various materials<br />Has excellent sealing and waterproofing properties, effectively preventing the entry of dust and moisture<br />Low overflow glue, easy for die cutting processing<br /><br />Suitable for bonding and fixing the borders of mobile phones and monitors, as well as bonding the borders of electronic product parts
Using PU foam as the substrate, combined with high-performance acrylic adhesive<br /><br />Excellent bonding performance for various materials<br />Has excellent shock absorption performance and sealing performance<br />Narrow specification die cutting with excellent dimensional stability<br /><br />Suitable for bonding and fixing TV and monitor frames, as well as bonding electronic product parts frames
<p>Design scheme using fiberglass cloth and no substrate, combined with high-performance thermal conductive adhesive<br /><br />Excellent bonding performance for various materials<br />Excellent high thermal conductivity and low thermal resistance performance<br />Different substrate designs, suitable for various application scenarios<br /><br />Suitable for bonding car screens, Light Bars, TVs and other areas that require heat dissipation</p>
Special adhesive design<br /><br />Different curing temperature designs provide high bonding strength for various materials<br />Short curing time and stable aging performance<br />Excellent die-cutting performance<br /><br />Suitable for bonding various leather, plastics, textiles, as well as bonding and fixing internal structural components of electronic products
Using metal foil as the substrate, combined with high-performance conductive adhesive<br /><br />Excellent bonding performance for various materials<br />Has excellent conductivity and excellent shielding effect<br />Special scheme design, reducing sensitivity to low temperature and humidity<br /><br />Suitable for electromagnetic shielding areas such as laptops, mobile phones, PDAs, PDPs, LCD displays, etc
Using conductive cloth as the substrate, combined with high-performance conductive adhesive<br /><br />Excellent bonding performance for various materials<br />Has good friction performance and high temperature resistance<br />Low adhesive permeability, easy to die cut<br /><br />Suitable for electromagnetic shielding areas such as laptops, mobile phones, PDAs, PDPs, LCD displays, etc
Using conductive sponge as the substrate, combined with high-performance conductive adhesive<br /><br />Excellent bonding performance for various materials<br />Has excellent conductivity, buffering, and excellent shielding effect<br />No chip shedding during die cutting, excellent aging stability<br /><br />Suitable for buffering and grounding areas such as laptops, mobile phones, PDAs, PDPs, LCD displays, etc
Made with green and pollution-free adhesive<br /><br />Excellent adhesion strength to electronic materials such as metals, PE, and PC, with a wide range of applications<br />Excellent heavy industry performance with no residue<br />Easy removal through stretching, supporting multi angle removal<br /><br />Suitable for fixing and bonding mobile phone batteries to the body, as well as fixing and bonding components that need to be replaced in the electronics industry
