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产品概述
Product Overview
Using conductive sponge as the substrate, combined with high-performance conductive adhesive

Excellent bonding performance for various materials
Has excellent conductivity, buffering, and excellent shielding effect
No chip shedding during die cutting, excellent aging stability

Suitable for buffering and grounding areas such as laptops, mobile phones, PDAs, PDPs, LCD displays, etc
产品列表
Product List
PN Thickness
(μm)		 Color Typical Adhesion
(g/inch)		 Surface Resistance
(Ω/□)		 Vertical Resistance
(Ω/□)		 Permanent compression deformation(%) Download Data
KCF-0151G-0.3T 300 Grey 1000 0.05 0.03 19.8 TDS
KCF-0186G-0.5T 500 Grey 1200 0.1 0.05 15 TDS
KCF-0186G-0.6T 600 Grey 1300 0.1 0.05 15 TDS
KCF-0186G-1.0T 1000 Grey 1300 0.1 0.05 12 TDS
KCF-0186G-1.2T 1200 Grey 1400 0.1 0.05 15 TDS
KCF-0186G-1.5T 1500 Grey 1300 0.1 0.05 14 TDS
KCF-0186G-2.0T 2000 Grey 1200 0.1 0.05 11 TDS
KCF-0186G-3.0T 3000 Grey 1100 0.1 0.05 7  TDS